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tck101g/102g 2014-03-01 1 toshiba cmos linear integrat ed circuit silicon monolithic tck101g, TCK102G 1a load switch ic with slew rate control driver the tck101g and TCK102G are load switch ics for power management with slew rate control driver featuring wide input voltage operation from 1.1 to 5.5 v. switch on resistance is only 55 m ? typical at 3.3 v, 500 ma l oad condition and these feature a slew rate control driver and thermal shutdown. tck101g has output auto-discharge function. ma ximum output current type is available up to 1 .0a (dc). this device is available in 0.4 mm pitch ultra small package wcsp6b (0.8 mm x 1.2 mm, t: 0.64 mm (max)). thus this device is ideal for portable applications that require high-density board assembly such as cellular phone. feature ? wide input voltage operation: v in = 1.1 to 5.5 v ? low on resistance : r on = 50 m ? (typ.) at v in = 5.0 v, 500 ma r on = 55 m ? (typ.) at v in = 3.3 v, 500 ma r on = 75 m ? (typ.) at v in = 1.8 v, 500 ma r on = 120 m ? (typ.) at v in = 1.2 v, 500 ma ? low quiescent current: i q = 8 a (typ.) at v in = v ct = 5.5 v, i out = 0 ma ? low standby current: i q(off) = 0.07 a (typ.) at off state ? inrush current reduction circuit ? thermal shutdown function ? auto-discharge (tck101g) ? pull down connection between control and gnd ? ultra small package : wcsp6b (0.8mm x 1.2mm, t: 0.64mm(max)) wcsp6b weight: 1 mg (typ.) start of commercial production 2012-08
tck101g/102g 2014-03-01 2 absolute maximum ratings (ta = 25c) characteristics symbol rating unit input voltage v in -0.3 to 6.0 v control voltage v ct -0.3 to 6.0 v output voltage v out -0.3 to v in +0.3 v output current i out dc 1.0 a power dissipation p d 800 (note 1) mw operating temperature range t opr ?40 to 85 c junction temeperature tj 150 c storage temperature t stg ?55 to 150 c note : using continuously under heavy loads (e.g. the application of high temperat ure/current/voltage and the significant change in temperature, etc. ) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operati ng temperature/current/voltage, etc. ) are within the absolute maximum ratings and the operating ranges. please design the a ppropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precau tions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note1: rating at mounting on a board (glass epoxy board dimension : 40mm x 40mm, both sides of board metal pattern ratio : a surface approximatel y 50%, the reverse side approximately 50% through hole: diameter 0.5mm x 28) pin assignment(top view) top marking index a1: v out b1: v out c1: gnd a2: v in b2: v in c2: control 1 2 a b c lot trace code p: tck101g r: TCK102G
tck101g/102g 2014-03-01 3 block diagram function table function part number thermal shutdown output auto-discharge control pin connection tck101g bulit in bulit in pull down TCK102G bulit in pull down thermal shut down control logic pull down v in v out gnd slew rate control driver output discharge (only tck101g) control
tck101g/102g 2014-03-01 4 electrical characteristics dc characteristics (ta = -40 to 85c) ta = 25c ta = ? 40 to 85c characteristics symbol test condition min typ. max min max unit input voltage v in ? 1.1 ? 5.5 1.1 5.5 v 1.2 v < v in 5.5 v 1.0 ? ? 1.0 ? control high-level input voltage v ih 1.1 v v in 1.2 v 0.9 ? ? 0.9 ? v control low-level input voltage v il v in = 1.1 to 5.5 v ? ? 0.4 ? 0.4 v quiescent current ( on state) i q i out = 0 ma, v in = v ct = 5.5 v ? 8 ? ? 20 a standby current ( off state) i q(off) v in = 5.5 v, v ct = 0 v, v out = open (note 2) ? 0.07 ? ? 1 a v in = 5.0 v ? 10 ? ? 1000 (note3) v in = 3.3 v ? 2 ? ? 1000 v in = 1.8 v ? 1 ? ? 1000 off-state switch current i sd(off) v ct = 0 v, v out = gnd v in = 1.2 v ? 1 ? ? 1000 na v in = 5.0 v ? 50 ? ? 70 v in = 3.3 v ? 55 ? ? 75 v in = 1.8 v ? 75 ? ? 100 v in = 1.2 v ? 120 ? ? 180 on resistance r on i out = 500 ma v in = 1.1 v ? 155 ? ? ? m discharge on resistance r sd ? ( tck101g) ? 100 ? ? ? note 2 except off-state switch current note 3 ta = 65
tck101g/102g 2014-03-01 5 ac characteristics (ta = 25c) v in = 1.2 v characteristics symbol test condi tion(figure 1) min typ. max unit v out rise time t r r l = 500 ? , c l = 0.1 f ? 370 ? s tck101g ? 25 ? v out fall time t f r l = 500 ? , c l = 0.1 f TCK102G ? 95 ? s turn on delay t on r l = 500 ? , c l = 0.1 f ? 390 ? s turn off delay t off r l = 500 ? , c l = 0.1 f ? 8 ? s v in = 3.3 v characteristics symbol test condi tion(figure 1) min typ. max unit v out rise time t r r l = 500 ? , c l = 0.1 f ? 170 ? s tck101g ? 45 ? v out fall time t f r l = 500 ? , c l = 0.1 f TCK102G ? 100 ? s turn on delay t on r l = 500 ? , c l = 0.1 f ? 135 ? s turn off delay t off r l = 500 ? , c l = 0.1 f ? 10 ? s ac waveform figure 1 t r , t f, t on, t off waveforms v ih v out v ct v ol v oh v il 90% t on t off 50% 50% 10% t r t f v out 10% 90% 90% 10%
tck101g/102g 2014-03-01 6 application note 1. application circuit example (top view) the figure below shows the recommended c onfiguration for tck101g and TCK102G. 1) input capacitor c in an input capacitor (c in ) is not necessary for the guaranteed operation of tck101g and TCK102G. however, it is recommended to use input capacitors to reduce voltage drop due to sharp changes in output current and also for improved stability of the power supply. when used, place c in as close to v in pin to improve stability of the power supply. also, due to the c in selected, v in < v out may occur, causing a reverse current to flow through the body diode of the pass-through p-ch mo sfet of the load switch ic. in this case, a higher value for c in as compared to c l is recommended. 2) output capacitor an output capacitor (c out ) is not necessary for the guaranteed oper ation of tck101g and TCK102G. however, there is a possibility of overshoot or undershoot caused by output load transient response, board layout and parasitic components of load switch ic. in this case, an output capacitor with c out more than 0.1 f us recommended. 3) control pin a control pins for tck101g and tck 102g are both active high, which c ontrols both the pass-through p-ch mosfet and the discharge n-ch mosfet (only for tck 101g), operated by the control voltage and schmitt trigger. when the control voltage level is high, p-ch mosfet is on state and n-ch mosfet is off state. when control voltage level is low, and the state of the mosfets is reversed. also , pull down resistance equivalent to a few m is connected between control and g nd, thus the load switch ic is in off state even when control pin is open. in addition, control pin has a tolerant function such that it can be used even if the control voltage is higher than the input voltage. control voltage output voltage high on low off open off v out gnd v in control c l r l load c in
tck101g/102g 2014-03-01 7 2. power dissipation power dissipation is measured on the board condition shown below. [the board condition] board material: glass epoxy (fr4) board dimension: 40mm x 40mm (both sides of board) t=1.8mm metal pattern ratio: a surface approximatel y 50%, the reverse side approximately 50% through hole: diameter 0.5mm x 28 please allow sufficient margin when designing a board pattern to fit the expected power di ssipation. also take into consideration the ambient te mperature, input voltage, ou tput current etc and applying the appropriate derating for allowable power dissipation during operation. 3. thermal shut down function thermal shutdown function is designed in these prod ucts, but these does not assure for the suppression of uprising device operation. in use of these products, please read through and understand dissipation idea for absolute maximum ratings from the ab ove mention or our ?semiconductor reliability handbook?. then use these products under absolute maximum ratings in any conditi on. furthermore, toshiba recommend inserting failsafe system into the design. 0 200 400 600 800 1000 -40 0 40 80 120 power dissipation p d (mw) ambient temperature ta () p d -ta
tck101g/102g 2014-03-01 8 tck101g, TCK102G representative characteristics s tan db y current i q(off) ( a) off-state switch current i sdoff ( n a) on res i stance r on ( m ? ) ta = 25 output current i out (ma) on res i stance r on ( m ? ) i out = 500ma r on - i out r on - v in input voltage v in (v) ta = 25 85 -40 v in = 1.2v 1.8v 3.3v > 5.0v i q - v in input voltage v in (v) q u i escent current (on state ) i q ( a) ta = 25 85 -40 input voltage v in (v) ta = 85 25 -40 i out = 0ma v ct = 5.5 v i q(off) - v in input voltage v in (v) ta = 85 25 -40 v ct = 0 v v out = open v ct = 0 v v out = gnd i sdoff - v in on res i stance r on ( m ? ) ambient temperature t a ( ) v in = 1.2v > 1.8v > 3.3v > 5.0v > i out = 500ma r on - t a
tck101g/102g 2014-03-01 9 i out ( m a ) v out ( v ) time t (100 s/div) v ct ( v ) 2.0 1.0 0 v in = 1.2v t on response 2.0 1.0 0 10 0 c l = 0.1 f 1.0 f 4.7 f time t (100 s/div) 1.0 0 v in = 3.3v t on response 4.0 2.0 0 50 0 c l = 0.1 f 1.0 f 4.7 f 2.0 time t (100 s/div) v in = 5.0v t on response c l = 0.1 f 1.0 f 4.7 f 1.0 0 4.0 2.0 0 100 0 2.0 tck101g t off response time t (250 s/div) 2.0 1.0 0 4.0 2.0 0 50 0 r l = 500 v in = 3.3v t off response c l = 0.1 f 1.0 f 4.7 f c l = 0.1 f 1.0 f 4.7 f time t (250 s/div) 2.0 1.0 0 2.0 1.0 0 10 0 r l = 500 v in = 1.2v t off response r l = 500 r l = 500 r l = 500 i out ( m a ) v out ( v ) v ct ( v ) i out ( m a ) v out ( v ) v ct ( v ) i out ( m a ) v out ( v ) v ct ( v ) i out ( m a ) v out ( v ) v ct ( v )
tck101g/102g 2014-03-01 10 c l = 0.1 f 1.0 f 4.7 f time t (250 s/div) 2.0 1.0 0 2.0 1.0 0 100 0 v in = 5.0v t off response TCK102G t off response time t (1ms/div) 2.0 1.0 0 4.0 2.0 0 50 0 v in = 3.3v t off response c l = 0.1 f 1.0 f 4.7 f c l = 0.1 f 1.0 f 4.7 f time t (1ms/div) 2.0 1.0 0 2.0 1.0 0 10 0 v in = 1.2v t off response c l = 0.1 f 1.0 f 4.7 f time t (1ms/div) 2.0 1.0 0 4.0 2.0 0 100 0 r l = 500 v in = 5.0v t off response r l = 500 r l = 500 r l = 500 i out ( m a ) v out ( v ) v ct ( v ) i out ( m a ) v out ( v ) v ct ( v ) i out ( m a ) v out ( v ) v ct ( v ) i out ( m a ) v out ( v ) v ct ( v )
tck101g/102g 2014-03-01 11 package dimension weight: 1 mg (typ.) unit: mm
tck101g/102g 2014-03-01 12 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively "toshiba"), reserve the right to make changes to the in formation in this document, and related hardware, software and systems (collectively "product") without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba's written permission, reproduc tion is permissible only if reproduction is without alteration/omission. ? though toshiba works continually to improve product's quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the "toshiba semiconductor reliability handbook" and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers' product design or applications. ? product is neither intended nor warranted fo r use in equipments or systems that require extraordinarily high levels of quality and/or reliability, and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage and/or serious public impact ( " unintended use " ). except for specific appl ications as expressly stated in this document, unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used f or automobiles, trains, ships and other transportation, traffic si gnaling equipment, equipment used to control combustions or expl osions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. if you use product for unintended use, toshiba assumes no liability for product. for details, please contact your toshiba sales representative. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? 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